CuDLP is a phosphorus-deoxidized copper in which the residual phosphorus is maintained at a low level to achieve a good electrical conductivity. CuDLP also known as C12000 copper has a good electrical conductivity and excellent welding and soldering properties. It is not readily susceptible to hydrogen embrittlement and its electrical conductivity is slightly lower than that of electrolytic tough pitch copper. It has excellent hot and cold workability and can be readily joined by soldering. It is used in a variety of architectural, electrical and hardware applications.

Phosphorus deoxidized coppers for general and chemical engineering applications, particularly when brazing or welding is involved. The alloy can be cold worked by conventional processes such as forming and bending, drawing, spinning, stamping, coining, heading and upsetting. Can be joined by soldering with excellent results and good results are achieved by brazing. Good results are obtained with resistance butt welding but the alloy is not suitable for joining by other resistance welding methods. Fair results are achieved by using oxyacetylene welding, gas shielded arc welding and carbon arc welding. Use of coated metal arc welding is not recommended.